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Light leads the future
Wisdom brings mutual benefit

Opto-Intel Technologies Co., Ltd., headquartered in Chongqing, China, is a semiconductor assembly?equipment manufacturer integrating R&D, manufacturing, and sales to provide professional?services to the domestic and global markets.

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Products & Solutions

  • Vacuum Soldering Reflow Technology

    By forming a vacuum environment, the bubbles in the molten solder liquid are discharged smoothly, so as to achieve high quality cavity-free brazing, and the inert, reducing atmosphere and leading microwave plasma auxiliary technology are used to improve the soldering quality. The technology can realize high strength soldering, has good soldering form control ability, has the characteristics of efficient and reliable, flexible process, stable and repeatable, widely used in semiconductor laser, optical communication module, microwave T/R components, power chip packaging and other fields.
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  • Microwave Plasma Cleaning Technology

    Treat the surface of the material through the plasma excited by the microwave electromagnetic wave, to achieve strong deoxidation and activation, ensure the cleanliness of the material surface, and improve the infiltration. This technology can provide a good foundation for the next process, and can greatly improve the reliability of packaging, with the characteristics of high efficiency, no damage, no pollution, low process temperature. Its main application on micro treatment with material surface, including decontamination, activation, modification, deoxidation, etching, descum and deposition, etc.
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  • Die Bonding Technology

    Die bonding, is the core step in semiconductor packaging, to precisely bonding diced dies onto substrates via high-precision equipment to achieve electrical and mechanical connections. Opto-Intel independently developed the die bonding technology integrated submicron-level visual alignment (precision ≤1μm), multi-process adaptability (adhesion/eutectic/pre-sintering), and intelligent real-time compensation systems. It addresses industry challenges such as ultra-thin chip fragility and thermal stress matching, enabling reliable packaging for high-value-added devices including IC chips, power modules (SiC/IGBT), optoelectronic communication chips, Micro/Mini LEDs, RF/microwave modules, and MEMS sensors.
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